1550nm 铟镓砷 Hybrid 3D stack LiDAR芯片

DX517是一款专门为人眼安全打造的堆叠封装远距离探测LiDAR芯片。其SPAD采用基于大芯半导体核心知识产权的铟镓砷材料，可以在1550nm波段实现高探测效率。该芯片将铟镓砷材料工艺的感光wafer和传统硅工艺的Logic wafer进行混合型堆叠封装。该芯片可以使用在自动驾驶汽车、无人机等各种远距离应用。

• 1550nm InGaAs SPAD
• Hybrid 3D Stack
• 300m long distance detection
• 3D LiDAR technology with high sensitivity SPAD detection
• Delivers high SNR, wide dynamic range and no multi-path reflections
• 10um x 10 um BSI pixels
• 200 x600 SPAD Detection And Ranging pixels
• Fast on-chip histogram processing
• Sub-nanosecond light pulse
• Sunlight on-chip rejection filter and algorithm
• Programmable Repetition rate